Have you ever felt that reality is deeper than what meets the eye? That perhaps our everyday experience is just the surface ...

根据行业研究机构报告，全球先进半导体封装市场被视为下一个重大增长点。 面向 2.5D/3D、高带宽互连、多芯片整合等需求的先进封装技术，将是未来 5–10 年半导体产业链的重要支撑。 以 3D 封装为例，市场研究显示从 2025 年起至 2034 年，3D 封装市场将以超过 16 ...