CAMBRIDGE, England & SANTA CLARA, Calif.--(BUSINESS WIRE)--Blueshift Memory, designer of a novel proprietary high-speed memory architecture, has announced that the Cambridge Architecture™ has been ...
BEIJING, Dec. 26, 2024 /PRNewswire/ -- WiMi Hologram Cloud Inc. (NASDAQ: WiMi) ("WiMi" or the "Company"), a leading global Hologram Augmented Reality ("AR") Technology provider, today announced the ...
With the particular needs of scientists and engineers in mind, researchers at the Department of Energy's Pacific Northwest National Laboratory have co-designed with Micron a new hardware-software ...
Intel recently demonstrated a new type of DIMM memory technology called Multiplexer Combined Rank (MCR), also referred to as MRDIMMs, that provides up to 2.3X better performance for HPC workloads and ...
Want smarter insights in your inbox? Sign up for our weekly newsletters to get only what matters to enterprise AI, data, and security leaders. Subscribe Now A new neural-network architecture developed ...
Artificial intelligence computing startup D-Matrix Corp. said today it has developed a new implementation of 3D dynamic random-access memory technology that promises to accelerate inference workloads ...
Neo Semiconductor X-HBM architecture will deliver 32K-bit wide data bus and potentially 512 Gbit per die density. It offering 16X more bandwidth or 10X higher density than traditional HBM. NEO ...
A new technical paper titled “Pushing the Memory Bandwidth Wall with CXL-enabled Idle I/O Bandwidth Harvesting” was published ...
Smart memory node device from UniFabriX is designed to accelerate memory performance and optimize data-center capacity for AI workloads. Israeli startup UniFabriX is aiming to give multi-core CPUs the ...
Infineon has expanded its wireless memory portfolio with CellularRAM, this is a customised memory solution designed and tailored for mid-range to high-end mobile phone applications. CellularRAM is ...
3D-IC technology marks a pivotal shift from scaling in two dimensions to scaling in three. By bringing compute, memory, and accelerators closer together, 3D-ICs overcome data-movement bottlenecks and ...
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